产品详情
千住水溶性锡膏
- 产品名称:千住水溶性锡膏
- 产品型号:M705-515A(8)C1-T8G
- 产品厂商:千住金属
- 产品文档:
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简单介绍
锡96.5、银3.0、铜0.5###熔点:217-220℃###粘度:180-220Pa.s###230-260℃###要求无松香残留的工艺,纯水能轻松清洗残留物###0-10℃
千住水溶性锡膏
的详细介绍千住水溶性锡膏 M705-515A(8)C1-T8G(无卤素锡膏)及M705-WSG15为千住金属开发之水洗性锡膏.
1.Scope
This specification covers the solder paste,
ECO SOLDER PASTE M705-515A(8)C1-T8G, using lead-free solder alloy, used
for wiring connection and so on, of electrical and electronic parts.
2.Standard
2.1 Chemical composition of solder alloy(Test method : STM-9-1)
Composition and impurities are prescribed as following tables.
Composition ( mass% )
Ag3.0 ± 0.1 /Cu0.50 ± 0.05/Sn
2.2 Melting temperature range and specific gravity of solder alloy(Reference value)
Melting temperature range ℃
Approx. 217 ~ 220

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