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千住水溶性锡膏
- 产品名称：千住水溶性锡膏
- 产品型号：M705-515A（8）C1-T8G
- 产品厂商：其它品牌
- 产品文档：
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简单介绍
千住水溶性锡膏 无卤素锡膏M705-515A(8)C1-T8G及M705-WSG15为千住金属开发之水洗性锡膏.
千住水溶性锡膏
的详细介绍
千住水溶性锡膏 M705-515A(8)C1-T8G（无卤素锡膏）
１．Scope
This specification covers the solder paste,
ECO SOLDER PASTE M705-515A(8)C1-T8G, using lead-free solder alloy, used
for wiring connection and so on, of electrical and electronic parts.
２．Standard
２.１ Chemical composition of solder alloy（Test method ： STM-9-1）
Composition and impurities are prescribed as following tables.
Composition ( mass% )
Ａｇ3.0 ± 0.1 /Ｃｕ0.50 ± 0.05/Ｓｎ
２.２ Melting temperature range and specific gravity of solder alloy(Reference value)
Melting temperature range ℃
Approx. 217 ～ 220
１．Scope
This specification covers the solder paste,
ECO SOLDER PASTE M705-515A(8)C1-T8G, using lead-free solder alloy, used
for wiring connection and so on, of electrical and electronic parts.
２．Standard
２.１ Chemical composition of solder alloy（Test method ： STM-9-1）
Composition and impurities are prescribed as following tables.
Composition ( mass% )
Ａｇ3.0 ± 0.1 /Ｃｕ0.50 ± 0.05/Ｓｎ
２.２ Melting temperature range and specific gravity of solder alloy(Reference value)
Melting temperature range ℃
Approx. 217 ～ 220
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